Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent
1998-05-29
2000-10-24
Breneman, R. Bruce
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
438693, 216 88, 216 89, 216 90, H01L 2100
Patent
active
061367117
ABSTRACT:
A chemical mechanical polishing composition comprising a composition capable of etching tungsten and at least one inhibitor of tungsten etching and methods for using the composition to polish tungsten containing substrates.
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Grumbine Steven K.
Hoglund Eric W.G.
Streinz Christopher C.
Breneman R. Bruce
Cabot Corporation
Powell Alva C
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