Electrodes on a mounting substrate and a liquid crystal display

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

174261, 359 59, 361760, 361777, H05K 702, G02F 1133, G02F 11343

Patent

active

055007872

ABSTRACT:
An electrode wiring on a mounting substrate adapted for use in liquid crystal display apparatus, the electrode wiring including portions of Mo or Mo alloy to which bumps of an integrated circuit such as LSI is bonded with conductive paste.

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IBM Disclosure Bulletin "Photo-Defined Lamination for Chip Bonding" by J. C. Edwards vol. 25 No. 4 Sep. 1982.

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