Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Patent
1998-11-25
2000-10-24
Picardat, Kevin M.
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
428 29, 313498, 313505, 313506, H01L 2100
Patent
active
061366226
ABSTRACT:
An EL device is provided by a method by forming a plurality of stripes of a first transparent electrode on a transparent substrate extending in one direction of the substrate, forming a plurality of stripes of an insulating partition wall on said first electrode in a direction perpendicular to said first electrode stripes, forming an organic layer and a second electrode in sequence on the partition wall stripes, adhering a sealing glass cap so as to cover all of the above layers and evacuating the inside of said sealing glass cap, and irradiating a laser light from the outside of the sealing glass cap toward the partition wall stripes so as to separate the second electrode to form a divided groove on the partition wall. Since the separation of the second electrode by fusion is carried out in a vacuum, so that the chips of metal evaporated by the photo-ablation stick on the inside wall of the glass cap without contaminating the inside of the divided portion, which results in the prevention of shorting of the second electrode and increases the manufacturing yields in the manufacturing process.
REFERENCES:
patent: 5614353 (1997-03-01), Kumar et al.
patent: 5814417 (1998-09-01), Nagayama
patent: 5955837 (1999-09-01), Horikx et al.
Fukuzawa Shinichi
Suzuki Hiroshi
NEC Corporation
Picardat Kevin M.
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