Wire wrap single in-line package

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

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Details

174 52PE, 361405, H05K 700

Patent

active

047775629

ABSTRACT:
A thick film passive network on an alumina substrate, the passive elements being terminated by conducting metal leads. The network, substrate and a small portion of each lead is encapsulated in a material with high insulation characteristics. The geometry of the leads and overall package alignment characterizes the device as a wire wrap SIP, use of which provides the capability of high board density and closer board-to-board spacing.

REFERENCES:
patent: 3501582 (1970-03-01), Heidler et al.
patent: 3699394 (1972-10-01), Schuler
patent: 3748538 (1973-07-01), Sheaeyian et al.
patent: 4603374 (1986-07-01), Wasielewski

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