Packaging structure for microwave circuit

Details Packaging structure for microwave circuit Packaging structure for microwave circuit

1994-07-11

1996-03-19

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257728, 257727, H01L 2324

Patent

active

055005560

ABSTRACT:
A packaging structure for a microwave circuit having excellent heat radiation and obviating an intricate and large-sized shielding case is provided, the packaging structure comprising a circuit module accommodating internally a semiconductor element and a mother substrate 10; the circuit module 1 having two grounding conductor layers, a center conductor layer inserted therebetween, center conductor electrodes connected to the center conductor, grounding conductor electrodes disposed in the vicinity thereof, on one of its surfaces, and a thermal spreading plate connected to the other surface; the mother substrate 10 having two grounding conductor layers, a center conductor layer inserted therebetween, center conductor electrodes, grounding electrodes disposed on one of its surfaces, wherein the circuit module and the mother substrate are bonded so as to have the mutual electrodes joined directly facing with each other; a heat conductive elastomer is inserted between the thermal spreading plate and a heat radiating plate; and a pressure is applied to the mother substrate by means of a spring in order to bring the thermal spreading plate and the heat conductive elastomer to a close contact.

REFERENCES:
patent: 4729060 (1988-03-01), Yamomoto et al.
patent: 5065280 (1991-11-01), Karnezos et al.
patent: 5247425 (1993-09-01), Takahasi
patent: 5345107 (1994-09-01), Daikoku et al.

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