Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...
Patent
1994-04-15
1996-03-19
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
In combination with or also constituting light responsive...
257 99, 257432, H01L 3300, H01L 2503
Patent
active
055005403
ABSTRACT:
A package and method for packaging optoelectronic or electronic components is provided in which multiple chip regions are packaged simultaneously prior to sectioning of the wafer into chips. The method and package allows micro-optic and other package elements to be integrated onto wafers on the same face as the optoelectronic or electronic devices without inhibiting the ability to make electrical contact to the devices. The package elements may be integrated to the wafer by material deposition, by spinning, or by physical mounting.
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Bryan Robert P.
Jewell Jack L.
Quinn William E.
Swirhun Stan E.
Limanek Robert P.
Photonics Research Incorporated
Williams Alexander Oscar
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