Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1998-07-06
2000-10-24
Osele, Mark A.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
156584, 438464, B32B 3500
Patent
active
061361372
ABSTRACT:
A method and system for dicing semiconductor components, such as bare dice and chip scale packages, are provided. Initially, the semiconductor components are contained on a wafer or a panel. Next, an insert that includes a base and an adhesive layer, is used to support the substrate for separation into separate components by sawing or other process. The insert with the separated components retained thereon, is then transferred to a carrier tray constructed according to JEDEC standards. The carrier tray is adapted for stacking and for handling by conveyors, magazines and other standard equipment. The system includes the substrate, the insert, and the standardized carrier tray.
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Farnworth Warren M.
Wood Alan G.
Gratton Stephen A.
Micro)n Technology, Inc.
Osele Mark A.
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