Method for manufacturing a bit line via hole in a memory cell

Details Method for manufacturing a bit line via hole in a memory cell Method for manufacturing a bit line via hole in a memory cell

1994-08-23

1996-03-19

Fourson, George

Fishing, trapping, and vermin destroying

437919, 437 52, H01L 2170, H01L 2700

Patent

active

055003842

ABSTRACT:
An improved method for manufacturing a bit line via hole for a memory cell is disclosed wherein changes in the topography of a conductive layer forming the cell plate that are caused by the capacitor are utilized for producing an etching mask for the bit line via hole. A depression is formed because the second source/drain region of the transistor which is to be contacted by the bit line is not covered by the lower capacitor plate. The etching mask is not produced in the depression but only at the raised locations and is therefore self-aligned above the second S/D region.

REFERENCES:
patent: 5135881 (1992-08-01), Saeki
patent: 5206183 (1993-04-01), Dennison
patent: 5223448 (1993-06-01), Su
patent: 5272103 (1993-12-01), Nakamura
Patent Abstracts of Japan, vol. 12, No. 320 (-651)(3167), JP 63-84149 (Hitachi Ltd.) Apr. 14, 1988.
Patent Abstracts of Japan, vol. 17, No. 672 (E-1474), JP-A-05 226 583 (NEC Corp) 3, Sep. 1993.
Patent Abstracts of Japan, vol. 17, No. 514 (E-1433), 1 Jun. 1993 JP A-05 136 124 (Fujitsu Ltd).
Article "A Self-Aligned Contact Process With Improved Surface Planarization" by Kusters et al, Journal De Physique, Cr, Tome 49, Sep. 1988 at C4-503.
"Two Step Deposited Rugged Surface (TDRS) Storagenode and Self Aligned Bitline-Contact Penetrating Cellplate (SABPEC) for 64 MbDRAM STC Cell" by Itoh, Oki Electric Industry Co., Ltd. pp. 9-10, VLSI Symposium 1991.

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