Processes and compositions for electroless metallization

Details Processes and compositions for electroless metallization Processes and compositions for electroless metallization

1994-10-04

1996-03-19

Schilling, Richard L.

Radiation imagery chemistry: process, composition, or product th

Imaged product

Deposited metal coating on image

430 17, 430315, 430324, 427 98, 427301, 427304, 427306, 428209, 428420, G03C 558, G03F 7038

Patent

active

055003150

ABSTRACT:
Methods and compositions for electroless metallization. In one aspect, the invention is characterized by the use of chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups that are chemically bound to the substrate. In a preferred aspect, the invention provides a means for selective metallization without the use of a conventional photoresist patterning sequence, enabling fabrication of high resolution metal patterns in a direct and convenient manner.

REFERENCES:
patent: 3671250 (1972-06-01), Andrews et al.
patent: 3853589 (1974-12-01), Andrews et al.
patent: 4426247 (1984-01-01), Tamamura et al.
patent: 4604699 (1986-08-01), DeLuca et al.
patent: 4661384 (1987-04-01), Sirinyan et al.
patent: 4666735 (1987-05-01), Hoover et al.
patent: 4738869 (1988-04-01), Baumgartner
patent: 4746536 (1988-05-01), Ichikawa et al.
patent: 4976990 (1990-12-01), Bach et al.
patent: 4981715 (1991-01-01), Hirsch et al.
patent: 4996075 (1991-02-01), Ogawa et al.
patent: 5045436 (1991-09-01), Tieke et al.
patent: 5077085 (1991-12-01), Schnur et al.
patent: 5079600 (1992-01-01), Schnur et al.

Affiliated with

Also associated with

Rating

Processes and compositions for electroless metallization does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Processes and compositions for electroless metallization, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Processes and compositions for electroless metallization will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1958613