Abrading – Precision device or process - or with condition responsive... – With feeding of tool or work holder
Patent
1998-07-30
2000-10-24
Rose, Robert A.
Abrading
Precision device or process - or with condition responsive...
With feeding of tool or work holder
451288, B24B 4700
Patent
active
06135855&
ABSTRACT:
Chemical mechanical planarization (CMP) of semiconductor wafers presents a harsh abrasive and chemical environment for equipment used in a polishing process. Prior art translation mechanisms are prone to failure due to corrosion and require maintenance that exposes the polishing process to contamination from lubricants. A translation mechanism (31) requiring no lubrication is designed to have maintenance at intervals greater than a CMP tool. The translation mechanism (31) includes a housing (32) and a moveable mount (33). The housing (32) and the moveable mount (33) are made of hardened stainless steel which is impervious to the CMP environment. Bearing shafts (39) buffer a threaded shaft (36) from side loading on the moveable mount (33). Polymer bearings (51) connected to moveable mount (33) provide a low friction contact surface to bearing shafts (39). A polymer translation nut (41) connects to the moveable mount (33) and is threaded onto the threaded shaft (36).
REFERENCES:
patent: 2998397 (1961-08-01), Riesing
patent: 4604833 (1986-08-01), Kimura et al.
patent: 5456627 (1995-10-01), Jackson et al.
patent: 5499942 (1996-03-01), Pflager
Huffman A. Kate
Motorola Inc.
Rose Robert A.
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