Automatic workpiece transport apparatus for double-side polishin

Details Automatic workpiece transport apparatus for double-side polishin Automatic workpiece transport apparatus for double-side polishin

1999-01-19

2000-10-24

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

By optical sensor

451291, B24B 722

Patent

active

061358541

ABSTRACT:
An automatic workpiece transport apparatus for a double-side polishing machine is disclosed. A carrier is positioned at a predetermined position by a positioning unit, and an image of the top surface of the carrier is captured by use of a visual sensor. A computer performs image processing to obtain the center coordinates of the wafers or the workpiece holders while reference marks or the like provided on the carrier are used as references. The transport robot is moved and controlled based on the thus-detected coordinate data in order to load the wafers into the workpiece holders or to unload the wafers from the workpiece holders. Further, two visual sensors are provided at the tip end of the arm of the transport robot. These visual sensors send to the computer an image of the peripheral portion of the held wafer. Thus, the computer performs fine adjustment in positioning the wafer and the workpiece. The automatic workpiece transport apparatus can reliably load and unload semiconductor wafers to and from the carrier that holds semiconductor substrates.

REFERENCES:
patent: 5333413 (1994-08-01), Hashimoto
patent: 5679055 (1997-10-01), Greene et al.

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