Method for manufacturing an encapsulated semiconductor package u

Details Method for manufacturing an encapsulated semiconductor package u Method for manufacturing an encapsulated semiconductor package u

1993-05-13

1994-04-19

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437219, H01L 2152, H01L 2158, H01L 2156, H01L 2160

Patent

active

053045130

ABSTRACT:
A process for manufacturing a carrier element is described that has one or more ICs to be incorporated into an identity card or credit card. The carrier element comprises a substrate having on its surface a plurality of contact areas which are connected via connector paths to corresponding terminals of the IC disposed on the substrate. The IC, including the connections to the conductor paths, is protected from mechanical stresses by a cured casting compound. In order to prevent the casting compound from flowing off uncontrollably during its application, an opening is provided in the heat-set adhesive layer applied to one side of the substrate, said opening holding back the liquid resin during its application and acting as a limiting frame. The opening in the adhesive layer is located at least where the IC is to be disposed.

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