Method for increasing the index of refraction of a glassy materi

Glass manufacturing – Processes of manufacturing fibers – filaments – or preforms – Process of manufacturing optical fibers – waveguides – or...

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65387, 65392, 65424, 65425, 65 301, 65 321, C03B 3200

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active

055000312

ABSTRACT:
In accordance with the invention, the index of refraction of a glassy material is increased by treating the material with hydrogen and applying heat. Specifically, the glass is exposed to hydrogen or deuterium at pressure in the range 14-11,000 p.s.i. and a temperature in the range 21.degree.-150.degree. C. for a time sufficient for the hydrogen to diffuse into the glass. The glass is then subjected to heat in excess of about 500.degree. C., as by application of a flame or infrared radiation. The duration of heating can be less than a second. The result is a substantial and long-lived increase in the normalized refractive index. For example, flame heating of H.sub.2 loaded commercial GeO.sub.2 doped optical fibers (AT&T Accutether single mode fiber) has produced normalized index changes .increment.n
of 4.times.10.sup.-3. This process can be used to make and adjust a variety of optical waveguide devices.

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Maxwell, G. D. et al "UV Written 13dB Reflection in Hydrog. LowLoss Planar Silica Waveguides", Electronic Letters, vol. 29 #5 pp. 425-426 (1993).
Atkins, R. M. et al "Effects of Elevated Temperature Hydrogen Exposure on Short-Wavelength Optical Losses and Defect Concentrations in Germanosilicate Optical Fibers" J. Appl. Phys. vol. 72 pp. 344-348 (1992).
G. Meltz et al. "International Workshop on Photoinduced Self-Organization Effects in Optical Fiber" Proc. SPIE-The International Society for Optical Engineering vol. 1516, pp. 185-199 (1991).
Lemaire et al. "High Pressure H_d2_u Loading As A Technique For Achieving Ultrahigh UV Potosensitivity And Thermal Sensitivity in GeO_d2_u Doped Optical Fibres" Electronics Lettes vol. 29, No. 13, pp. 1191-1193 (1993).
C. H. Henry, et al. "Glass Waveguides on Silicon for Hybrid Optical Packaging" J. of Lightwave Tech. vol. 7, No. 10, pp. 1530-1539 (1989).

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