Method for bonding semiconductor substrates

Details Method for bonding semiconductor substrates Method for bonding semiconductor substrates

1996-07-05

1998-05-26

Aftergut, Jeff H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

148DIG12, 148DIG135, 156153, 1562722, 437921, 437974, H01L 2120, H01L 2102

Patent

active

057559147

ABSTRACT:
A semiconductor substrate comprises a plurality of substrates to be bonded, wherein a bond promotion layer into which silicon atoms are implanted is provided in an interface between the substrates to be bonded, and the substrates are bonded to each other with the interposition of the bond promotion layer.

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Extended Abstract of Fall Meeting of Electrochemical Society, Phoenix, Arizona, Oct. 13-17, 1991, pp. 674-749.
Fripp, A.L., et al, "Structure of Silicon Films Deposited on Oxidized Silicon Wafers", J. Electrochem. Soc.: Solid State Science, vol. 117, No. 12 (Dec. 1970), pp. 1569-1571.

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