Semiconductor package electrostatic discharge damage protection

Details Semiconductor package electrostatic discharge damage protection Semiconductor package electrostatic discharge damage protection

1995-06-05

1996-09-03

Gaffin, Jeffrey A.

Electricity: electrical systems and devices

Safety and protection of systems and devices

Load shunting by fault responsive means

361 91, 361111, 361118, 361130, H02H 322

Patent

active

055529518

ABSTRACT:
A semiconductor circuit package includes features forming an electrostatic charge distribution network having nodes which are defined by the electrical contact leads of the package for the semiconductor circuit, and which are effectively connected with one another by spark-gaps. In one embodiment electrical leads of the package are provided with pointed protrusions lying in the plane of the electrical leads. Accordingly, an inadvertent electrostatic discharge is distributed throughout the semiconductor circuit at safe voltage levels determined by the characteristics of the spark gaps of the charge distribution network.

REFERENCES:
patent: 4791524 (1988-12-01), Teigen
patent: 4953007 (1990-08-01), Erdos
patent: 5424896 (1995-06-01), Pasch et al.

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