Thin film deposition apparatus

Details Thin film deposition apparatus Thin film deposition apparatus

1974-11-01

1977-03-22

Kaplan, Morris

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

118 491, 118 2, 432236, C23C 1500

Patent

active

040135390

ABSTRACT:
A method and apparatus for the deposition of a thin film on a substrate in which a length of the substrate such as for example, flexible plastic film, is transported in a path which follows along a convoluted configuration through a pressure vessel and therein is subjected to deposition effects. Such deposition effects, for example, comprise high frequency sputtering plasma. The helical path is arranged so that the substrate is carried through the influence of the deposition effects a plurality of times and at speeds which are much greater than those of known methods and apparatus. As a result, the deposition of the thin film is more uniform and a high throughput is achieved. Many other advantages are also achieved. In addition to conventional types of cooling, efficient cooling is obtained by magnetically sweeping secondary electrons away from the substrate. Batch and continuous processing are disclosed.

REFERENCES:
patent: 3272175 (1966-09-01), Lorenz et al.
patent: 3284892 (1966-11-01), Wade
patent: 3330752 (1967-07-01), Hallen et al.
patent: 3488617 (1970-01-01), Dietrich et al.
patent: 3528902 (1970-09-01), Wasa et al.
patent: 3598639 (1971-08-01), Hansson et al.
patent: 3600122 (1971-08-01), Coleman
patent: 3630872 (1971-12-01), Reichelt
patent: 3650737 (1972-03-01), Maissel et al.

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