Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-05-12
1999-02-09
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257706, 257707, 257713, 257722, 438122, H01L 2334, H01L 2310
Patent
active
058698914
ABSTRACT:
A method and apparatus for dissipating heat from a semiconductor device. A heat sink embodying the method includes an exterior surface contoured to better facilitate heat dissipation and/or direct a flow of air or fluid over the heat sink. In one embodiment, the heat sink includes a heat sink layer formed from a powdered metal. In another embodiment, the heat sink layer is contoured with a selected combination of bumps, indentations and holes. In yet another embodiment, the heat sink includes a stack of such heat sink layers which are mechanical; interfitted and thermally coupled.
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Rostoker Michael D.
Schneider Mark
LSI Logic Corporation
Saadat Mahshid D.
Wilson Allan R.
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