Semiconductor package fabricated by using automated bonding tape

Details Semiconductor package fabricated by using automated bonding tape Semiconductor package fabricated by using automated bonding tape

1995-09-29

1999-02-09

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

257737, 257778, H01L 2306

Patent

active

058698876

ABSTRACT:
A transparent base film of a semiconductor device package has a device hole into which a semiconductor chip is inserted. Formed on the base film are a plurality of pads arranged as a matrix from wirings for connecting the plurality of pads to the electrodes of the semiconductor chip. A transparent cover resist is applied to the entire surface of the base film except for the top portions of the plurality of pads, and spherical bumps are formed respectively on the plurality of pads. With this arrangement, it is possible to make inspection of bonding conditions between the bumps and the outer lead bonding pads on a printed circuit board even after the package is mounted on the printed circuit board.

REFERENCES:
patent: 5045921 (1991-09-01), Lin et al.
patent: 5184207 (1993-02-01), Cain
patent: 5224264 (1993-07-01), Takahashi et al.
patent: 5350947 (1994-09-01), Takekawa et al.
patent: 5420460 (1995-05-01), Massingill
Motorola Technical Developments, vol. 17, Dec. 1992 Schaumburg, Illinois, US, pp. 74-76, XP 000329496, Harry Geyer `New Tab Outer Lead Assembly Method-Tab Pad Grid Array Carrier`.
NEC Research and Development, vol. 35, No. 4, Oct. 1994, Tokyo JP, p. 496 `Development of Tape-BGA For Ultra-High Pin Count Applications`.
Nikkei Microdevices, Mar. 1994, pp. 58-64.

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