Printhead element butting

Details Printhead element butting Printhead element butting

1995-12-18

1998-05-26

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

298901, 29414, 347 42, H05B 300

Patent

active

057550247

ABSTRACT:
A large array or pagewidth printhead fabricated from printhead elements or subunits. The printhead subunits are butted together at either adjacent channel elements or adjacent heater elements to form a pagewidth printhead. The butting element, either heater or channel element, is slightly wider than the non-butting element thereby providing gaps between the non-butting elements of a printhead element array. Where channel elements are used as the butting element, gaps between the heater elements provide for reduction or elimination of potentially damaging thermal compressive forces between adjacent heater elements. Where heater elements are used as the butting element, structural strength is increased since the heater wafer is stronger than the channel wafer. In addition, the width of the polyimide wall at the edges of the heater wafer is increased providing greater protection for thermal transducers located at the edges of individual heater elements.

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