1980-11-06
1983-08-23
Davie, James W.
357 68, H01L 2348
Patent
active
044007140
ABSTRACT:
A lead frame is provided which allows for the lengthening of leads caused by the bonding of the lead tips to a ceramic substrate, without causing the lead frame to deform in a vertical direction. The lead frame comprises a generally flat but relatively rigid outer frame portion. Lead support members integral with the outer frame portion support a plurality of integrally formed leads. The leads are attached at one end to a lead support member. The other end of each lead is free for bonding to the conductor pads of a substrate. The lead support members are constructed to yield and deform in the horizontal plane of the lead frame in a direction outward along the longitudinal axis of the leads to accommodate the flow of metal and thermal expansion of the leads due to bonding. Several embodiments are disclosed showing different possibilities for constructing the lead support members to yield in the plane of the frame. In one embodiment, the lead support member is an elongated bar attached at each end thereof to the outer frame. A notch at each attachment site reduces the area of the frame at that point, allowing space for the support member to bend outwardly under pressure from the leads. A diagonal crosspiece may be attached to prevent the support member from deforming vertically. In each corner of the frame leads project from support members which are attached at an acute angle to structure in a corner area of the support frame. In a second embodiment, the corner leads project from cup-shaped structures in corner areas of the frame.
REFERENCES:
patent: 3971062 (1976-07-01), Merkle
patent: 4301464 (1981-11-01), Otsuki et al.
Carroll J.
Davie James W.
Jade Corporation
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