Process for manufacturing a molded electronic component having p

Details Process for manufacturing a molded electronic component having p Process for manufacturing a molded electronic component having p

1997-07-25

2000-10-03

Graybill, David E.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438112, 438123, H01L 2144, H01L 2148, H01L 2150

Patent

active

061272051

ABSTRACT:
A process for manufacturing a molded elecronic component such as a solid electrolyte capacitor comprising a capacitor element including a cathode layer, an anode lead, a pre-plated anode lead terminal connected to the anode lead, a pre-plated cathode lead terminal connected to the cathode layer, and an insulating member which encapsulates the capacitor element and leaves a portion of the anode and cathode lead terminals exposed. The encapsulated portions of the pre-plated anode and cathode lead terminals have a plating layer formed thereon containing organic substances in an amount of 0.03 wt. % or less.

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Patent Abstracts of Japan, vol. 14, No. 566 (C-0789), Dec. 17, 1990.
Patent Abstracts of Japan, vol. 95, No. 11, Dec. 26, 1995.
Tijdschrift Voor Oppervlaktetechinieken van Materialen, vol. 29, No. 2, Feb. 1985, pp. 44-47.

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