Method and system for applying solder paste on tape carrier pack

Details Method and system for applying solder paste on tape carrier pack Method and system for applying solder paste on tape carrier pack

1997-05-19

1999-02-09

Funk, Stephen R.

Printing

Stenciling

Traveling-inker machines

101127, B41F 1544, B41N 124

Patent

active

058680705

ABSTRACT:
A method for applying solder paste on tape carrier package component sites of a printed circuit board is disclosed. In accordance with a method and system of the present invention, a stencil having multiple openings for each device pad on the printed circuit board is provided. Each of the openings is approximately 0.012".times.0.0053" in size. The stencil is then secured in a fixed position directly above a printed circuit board. Finally, solder paste is selectively applied to the printed circuit board through the stencil with an applicator.

REFERENCES:
patent: 5553538 (1996-09-01), Freitag
patent: 5593080 (1997-01-01), Teshima et al.
patent: 5715748 (1998-02-01), Murakami et al.

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