Polyamide resin composition

Details Polyamide resin composition Polyamide resin composition

1996-03-11

1997-09-23

Sweet, Mark D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525134, 525145, 525183, 525184, 524403, 524435, 524398, C08F 800

Patent

active

056705760

ABSTRACT:
The present invention provides a polyamide resin composition which has low water absorption and simultaneously has satisfactory combustion properties. Illustrative compositions contain 20-80 parts by weight of polyamide resin and 80-20 parts by weight of polyphenylene ether resin or a mixture of this resin and polystyrene resin, as well as 0.01-10 parts by weight of a compatibilizer, 1-50 parts by weight of an uncured phenol novolak resin, and 0-80 parts by weight of a rubber component wherein the weights of the compatibilizer, uncured phenol novolak resin and rubber component is based on a total of 100 parts by weight of polyamide and polyphenylene ether resins.

REFERENCES:
patent: 4182697 (1980-01-01), Schmidt et al.
patent: 4315086 (1982-02-01), Ueno et al.
patent: 4338421 (1982-07-01), Maruyama et al.
patent: 4600741 (1986-07-01), Aycock et al.
patent: 4642358 (1987-02-01), Aycock et al.
patent: 4654405 (1987-03-01), Jalbert
patent: 4659760 (1987-04-01), van der Meer
patent: 4728693 (1988-03-01), Droscher et al.
patent: 4743651 (1988-05-01), Shibuya et al.
patent: 4745157 (1988-05-01), Yates, III et al.
patent: 4755566 (1988-07-01), Yates, III
patent: 4760115 (1988-07-01), Droescher et al.
patent: 4772664 (1988-09-01), Ueda et al.
patent: 4792586 (1988-12-01), Han
patent: 4798865 (1989-01-01), Grant et al.
patent: 4822836 (1989-04-01), Wroczynski
patent: 4822837 (1989-04-01), van der Meer
patent: 4824915 (1989-04-01), Aycock et al.
patent: 4826933 (1989-05-01), Grant et al.
patent: 4839425 (1989-06-01), Mawatari et al.
patent: 4857575 (1989-08-01), van der Meer et al.
patent: 4859739 (1989-08-01), Yates, III et al.
patent: 4866114 (1989-09-01), Tabuitz et al.
patent: 4873286 (1989-10-01), Gallucci et al.
patent: 4874810 (1989-10-01), Lee, Jr. et al..
patent: 4877847 (1989-10-01), Masu et al.
patent: 4885334 (1989-12-01), Mayumi et al.
patent: 4888397 (1989-12-01), van der Meer et al.
patent: 4889889 (1989-12-01), Yates, III
patent: 4923924 (1990-05-01), Grant
patent: 4929675 (1990-05-01), Abe et al.
patent: 4957965 (1990-09-01), Taubitz et al.
patent: 4960825 (1990-10-01), van der Meer
patent: 4963620 (1990-10-01), Grant et al.
patent: 4968749 (1990-11-01), Shibuya et al.
patent: 4970272 (1990-11-01), Gallucci
patent: 4981920 (1991-01-01), Terashima et al.
patent: 4990564 (1991-02-01), Taubitz et al.
patent: 5000897 (1991-03-01), Chambers
patent: 5001181 (1991-03-01), Takagi et al.
patent: 5017652 (1991-05-01), Abe et al.
patent: 5017663 (1991-05-01), Mizuno et al.
patent: 5019626 (1991-05-01), Taubitz et al.
patent: 5026787 (1991-06-01), Takagi et al.
patent: 5039746 (1991-08-01), Neugebauer et al.
patent: 5041504 (1991-08-01), Brown et al.
patent: 5053458 (1991-10-01), Taubitz et al.
patent: 5055494 (1991-10-01), van der Meer
patent: 5069818 (1991-12-01), Aycock et al.
patent: 5070151 (1991-12-01), Mizuno et al.
patent: 5073596 (1991-12-01), Inoue et al.
patent: 5073620 (1991-12-01), Sanada et al.
patent: 5084523 (1992-01-01), Neugebauer et al.
patent: 5086105 (1992-02-01), Abe et al.
patent: 5091473 (1992-02-01), Arashiro et al.
patent: 5096979 (1992-03-01), Brown et al.
patent: 5109052 (1992-04-01), Kasai et al.
patent: 5112907 (1992-05-01), Nishio et al.
patent: 5115010 (1992-05-01), Sakai et al.
patent: 5115044 (1992-05-01), Neugebauer
patent: 5120800 (1992-06-01), Tsukahara et al.
patent: 5120801 (1992-06-01), Chambers
patent: 5122575 (1992-06-01), White et al.
patent: 5124391 (1992-06-01), Muehlbach et al.
patent: 5134196 (1992-07-01), van der Meer
patent: 5145904 (1992-09-01), Muehlbach et al.
patent: 5147942 (1992-09-01), Abe et al.
patent: 5153266 (1992-10-01), Muehlbach et al.
patent: 5159008 (1992-10-01), Nishida et al.
patent: 5159018 (1992-10-01), Nishio et al.
patent: 5159075 (1992-10-01), Phanstiel et al.
patent: 5162433 (1992-11-01), Nishio et al.
patent: 5162440 (1992-11-01), Akkepeddi et al.
patent: 5162447 (1992-11-01), Abe et al.
patent: 5166237 (1992-11-01), Abe et al.
patent: 5175211 (1992-12-01), Sanada et al.
patent: 5182336 (1993-01-01), Abe et al.
patent: 5210125 (1993-05-01), Pernice et al.
patent: 5212256 (1993-05-01), Mizuno et al.
patent: 5225270 (1993-07-01), Bhoori et al.
patent: 5237002 (1993-08-01), Nishio et al.
patent: 5244973 (1993-09-01), Sakazume et al.
patent: 5248728 (1993-09-01), Lee, Jr.
patent: 5262478 (1993-11-01), Nishio et al.
patent: 5266673 (1993-11-01), Tsukahara et al.
patent: 5288786 (1994-02-01), Nishio et al.
patent: 5296533 (1994-03-01), Nagaoka et al.
patent: 5310821 (1994-05-01), Kodaira et al.
patent: 5331060 (1994-07-01), Aycock et al.
patent: 5336732 (1994-08-01), Samuels
patent: 5378750 (1995-01-01), Sayed et al.
patent: 5474853 (1995-12-01), Watanabe et al.

Affiliated with

Also associated with

Rating

Polyamide resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyamide resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyamide resin composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1938936