Process of conveying an encapsulated electronic component by eng

Details Process of conveying an encapsulated electronic component by eng Process of conveying an encapsulated electronic component by eng

1994-06-16

1997-09-23

Graybill, David E.

Fishing, trapping, and vermin destroying

437211, 437212, 437216, 437217, 437222, 437243, 26427217, H01L 2156, H01L 2158, H01L 2168

Patent

active

056704291

ABSTRACT:
A process for manufacturing an encapsulated electronic part having a resin body and an inwardly tapered projecting holding member removably attached to the resin body which may be made of the same resin and formed at the same time as the resin body, The encapsulated electronic part may be conveyed to a test device or to a circuit board and mounted thereon by gripping the holding member with a holding device. The holding member may have a shape conforming to the shape of the holding device and may be separated from the resin body by moving the holding device while holding the resin body stationary.

REFERENCES:
patent: 4936734 (1990-06-01), Osada
patent: 4954308 (1990-09-01), Yabe et al.
patent: 5051813 (1991-09-01), Schneider et al.
patent: 5369058 (1994-11-01), Burns et al.
European Search Report dated Dec. 5, 1994 in EPO Application No. 94110096.8 .

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