Assembly technique for an image sensor array

Details Assembly technique for an image sensor array Assembly technique for an image sensor array

1995-02-28

1997-09-23

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156285, 156382, 156539, 156562, 269 21, 269903, 29740, 29743, 29834, H05K 1304

Patent

active

056700091

ABSTRACT:
A package design and a method of assembling an array of CCD image devices on a substrate to provide an assembly with an optically flat surface. A tolerance of approximately between 2 and 3 microns is achieved by a process requiring less finishing of the substrates used by conventional processes. The assembly package can be used to bond an array of image sensors on a substrate having less than optimum flatness while still maintaining the optical surfaces of the image sensors within a single focal plane.

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