Method for fabricating MESFET device using a double LOCOS proces

Metal working – Method of mechanical manufacture – Assembling or joining

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29576B, H01L 2126

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active

044661746

ABSTRACT:
MESFET devices are fabricated on a semiconductor substrate using a LOCOS (localized oxidation of silicon) process twice during the fabrication. The first LOCOS process provides device separation with a self-aligned thick-field oxide (SATO). The second LOCOS provides separation of gate and source/drain regions for each device, and self-aligns the gate contact with the channel implant. Devices fabricated by this method exhibit reduced series resistance, and improved metal step coverage.

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patent: 4356040 (1982-10-01), Fu
"Method for Fabricating a Self-Aligned Vertical PNP Transistor", Isaac et al., IBM Technical Disclosure Bulletin, vol. 22, No. 8A, Jan. 1980, pp. 3203-3206.

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