Metallized frame which interconnects etched wirings for integrat

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

361421, 29847, H05K 100

Patent

active

052181723

ABSTRACT:
The invention is directed to an etched wiring (spider) for integrated circuits having a metallic frame for electrodeposition and shorting purposes proceeding all around at the periphery and connecting the wiring at several points. When separating a plurality of circuits lying side-by-side after the electrodeposition, an entire strip of the carrier material previously had to be discarded in order to enable the short-free separation of the etched wirings. In order to avoid this waste, the invention provides that the leads to the junctions of the frame with the wiring of neighboring circuits be fashioned meander-like.

REFERENCES:
patent: 3440027 (1969-04-01), Hugle
patent: 3821847 (1974-07-01), Melse et al.
patent: 4631100 (1986-12-01), Pellegrino

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