Method of making pre-formed lead-ins for an IC package

Details Method of making pre-formed lead-ins for an IC package Method of making pre-formed lead-ins for an IC package

1988-01-19

1989-10-10

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174 524, 357 70, H01R 4300

Patent

active

048722600

ABSTRACT:
Lead-ins for IC packages are pre-formed before attachment to a package substrate. The process comprises forming lead-in segments in continuous strip with the lead-ins being maintained in position by oppositely disposed, removable rails. A segment is separated from the strip and one end of the lead-ins is formed into, e.g., a "J" shape. One rail is removed during the forming process. The last rail is not removed until the segment is mounted upon a substrate.

REFERENCES:
patent: 4079511 (1978-03-01), Grabbe
patent: 4496965 (1985-01-01), Orcutt et al.
patent: 4554404 (1985-11-01), Gilder, Jr. et al.
patent: 4663650 (1987-05-01), Gilder, Jr. et al.
patent: 4663651 (1987-05-01), Gilder, Jr. et al.
patent: 4698660 (1987-10-01), Kubota et al.
patent: 4711700 (1987-12-01), Cusack
IBM Tech Discl Bull., vol. 28, No. 12, May 1986, pp. 5174-5175.

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