Polyoxymethylene molding materials having improved thermal stabi

Details Polyoxymethylene molding materials having improved thermal stabi Polyoxymethylene molding materials having improved thermal stabi

Filed on

1991-10-07

Date issued

1993-06-08

Examiner

Michl, Paul R.

Patent Class

Synthetic resins or natural rubbers -- part of the class 520 ser

SubClass

Synthetic resins

SubSubClass

At least one aryl ring which is part of a fused or bridged...

Other Related Categories

524291, 524424, 525155, 525400, C08L 6100, C08K 513, C08K 304

Type

Patent

Status

active

Patent number

052180417

Description

ABSTRACT:
Polyoxymethylene molding materials having improved thermal stability and reduced formaldehyde emission consisting essentially of a polyoxymethylene as the main component and containing in addition, relative in each instance to the weight of the polyoxymethylene, 0.1 to 10% by weight of an endocopolymerizate, 0.05 to 3% by weight of a phenolic antioxidant, 0 to 5% by weight carbon black and 0 to 3% by weight of further additives customary in polyoxymethylene molding materials.

REFERENCES:
patent: 3642940 (1972-02-01), Burg et al.
patent: 4000216 (1976-12-01), Lang
patent: 4672083 (1987-06-01), Amann et al.
patent: 4837400 (1989-06-01), Walter et al.
patent: 4987174 (1991-01-01), Ying et al.

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