Method of forming a device by selectively thermal spraying a met

Details Method of forming a device by selectively thermal spraying a met Method of forming a device by selectively thermal spraying a met

1995-02-14

1996-09-24

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361796, 361800, 361818, 174 35R, H05K 900

Patent

active

055596770

ABSTRACT:
The method disclosed herein begins with a molded housing (13 or 31). In one embodiment (20) the molded housing (13) has a ground shield (14) that is formed by thermally spraying a metallic conductive material onto the housing (13). Electrical connections are then made to link an electronic circuit on a printed circuit board assembly (21) to the ground shield (14). In another embodiment (30), the molded housing (31) has a plurality of elements (such as an indented channel (32), extrusions (33), a slot connector (34), and a notch (35)) that are thermally sprayed in selected areas to form a plurality of connective elements required by the electronic circuit of the printed circuit board assembly.

REFERENCES:
patent: 4532152 (1985-07-01), Elarde
patent: 4890199 (1989-12-01), Beutler
patent: 5313371 (1994-05-01), Knecht et al.

Affiliated with

Also associated with

Rating

Method of forming a device by selectively thermal spraying a met does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming a device by selectively thermal spraying a met, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a device by selectively thermal spraying a met will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1933744