Heat sink and mounting structure for heat sink

Details Heat sink and mounting structure for heat sink Heat sink and mounting structure for heat sink

1995-12-15

1996-09-24

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 165121, 174 163, H05K 720

Patent

active

055596746

ABSTRACT:
A structure for mounting a heat sink onto an integrated circuit package mounted on a printed circuit board is constructed such that a guide member having a frame portion and support post portions is fixed to the printed circuit board, and the heat sink is seated on an inner periphery of the guide member such that the heat sink may closely contact the integrated circuit package. A cover is fixed to the guide member such that it covers outer peripheral edge portions of an upper face of the heat sink. This structure is high in cooling efficiency and is easy to mount.

REFERENCES:
patent: 4164003 (1979-08-01), Cutchaw
patent: 4345267 (1982-08-01), Corman et al.
patent: 4716494 (1987-12-01), Bright et al.
patent: 5019940 (1991-05-01), Clemens
patent: 5288203 (1994-02-01), Thomas
patent: 5299632 (1994-04-01), Lee
patent: 5309983 (1994-05-01), Bailey
patent: 5335722 (1994-08-01), Wu
patent: 5430611 (1995-07-01), Patel et al.
Research Disclosure, No. 318, Oct. 1990, Havant GB, p. 851 `Spring-Loaded Heat Sinks for VLSI Packages`.

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