Semiconductor device having peripheral metal wiring

Details Semiconductor device having peripheral metal wiring Semiconductor device having peripheral metal wiring

1992-07-08

1995-02-21

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257207, 257920, H01L 23485, H01L 2940

Patent

active

053919203

ABSTRACT:
At a peripheral area of a semiconductor chip where active elements are not formed, a layer underlying a power supply wiring or ground wiring is provided with an uneven surface. The uneven or corrugated surface at the interface between the wiring and the underlying layer makes the wiring unsusceptible to slide. The uneven surface can be realized by interposing foreign matters between insulating layers, by selectively reducing the thickness of an insulating layer, or by forming openings in an insulating layer.

REFERENCES:
patent: 4914503 (1990-04-01), Shirato et al.
patent: 5287002 (1994-02-01), Freeman, Jr. et al.

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