Method for manufacturing integrated circuits with a step for rep

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437923, 437 54, 437205, H01L 2100

Patent

active

053915011

ABSTRACT:
A method for manufacturing a semiconductor integrated circuit device is described. The method comprises forming a plurality of macrocells each comprising a semiconductor integrated circuit on a semiconductor layer of an SOI (silicon on insulator) substrate, subjecting an insulating film for element separation and an insulating film in the substrate to wet etching thereby removing an unnecessary macrocell, and attaching a desired macrocell separated fabricated to the removed macrocell region. The semiconductor integrated circuit device is also described, which is free of defects and has multifunction and high reliability.

REFERENCES:
patent: 4806503 (1989-02-01), Yoshida et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for manufacturing integrated circuits with a step for rep does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing integrated circuits with a step for rep, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing integrated circuits with a step for rep will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1929438

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.