Method for depositing and patterning thin films formed by fusing

Details Method for depositing and patterning thin films formed by fusing Method for depositing and patterning thin films formed by fusing

1994-03-24

1996-09-24

Breneman, R. Bruce

Fishing, trapping, and vermin destroying

437233, 437234, 437245, 216 40, 15665911, 385122, 359326, H01L 2120, H01L 2144, G02B 600, G02F 100

Patent

active

055590578

ABSTRACT:
Patterns or circuits of semiconductors or metals are produced with dimensions at least as small as 7 nm using nanocrystalline precursors. The substrate is masked with an electron beam sensitive layer and a pattern is traced using a focused electron beam. Exposure to a source of nanocrystalline material and dissolution of the mask material produces patterned features of nanocrystals. The sample may then be heated to form a bulk thin film or left unheated, preserving the electronic properties of the isolated particles. The process is repeatable with different materials to build laminar structures of metals, semiconductors and insulators.

REFERENCES:
patent: 5262357 (1993-11-01), Alivisatos et al.
Science; Goldstein, A., Echer, C., Alivisatos, A., Jun. 1992, vol. 256, pp. 1425-1427, "Melting in Semiconductor Nanocrystals".
Physical Review A; Buffat, Ph., Borel, J-P., vol. 13, No. 6, Jun. 1976 "Size effect on the melting temperature of gold particles".
Physical Review Letters; Erolessi, F., Andreoni, W., Tosatti, E., vol. 66, No. 7, Feb. 91 "Melting of Small Gold Particles".
J. Phys. D: Appl Phys; Wautelet, M., vol. 24, pp. 343-346 (1991) "Estimation of the variation of the melting temperature with the size of small particles . . . ".
Physical Review A; Berry, R., Jellinek, J., Natanson, G., vol. 30, No. 2, "Melting of clusters and melting".
Y. Wada; T. Kure; T. Yoshimura; Y. Sudo; T. Kobayashi; Y. Goto; S. Kondo; Fabrication of Less Than a 10 nm Wide Polycrystalline Silicon Nano Wire, Jpn. J. Appl. Phys., vol. 33 (1994), pp. 905-908, Jan. 1994.
J. R. Heath, S. M. Gates, C. A. Chess, "Nanocrystal seeding: A low temperature route to polycrystalline Si films", Appl. Phys. Lett. 64(26), 27 Jun. 94, pp. 3569-3571.
G. Samdani, S. Moore, G. Parkinson, "Tiny Particles Aim for Big Markets", Chemical Eng./Aug. 94 pp. 35-39.
`Silicon Proc. in VLSI Era` Wolf, Stanely pp. 535 and 508 (1986).

Affiliated with

Also associated with

Rating

Method for depositing and patterning thin films formed by fusing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for depositing and patterning thin films formed by fusing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for depositing and patterning thin films formed by fusing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1928273