Method for ball bumping a semiconductor device

Fishing – trapping – and vermin destroying

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2281791, H01L 2160

Patent

active

055590543

ABSTRACT:
A ball bump is formed on a semiconductor die (12) by lowering a capillary (18) and a conductive wire (20) having a ball (30) formed at its end toward the die. The ball is pressed against a bond pad (14) of the die to form a ball bond (32). The capillary is then raised and horizontally displaced without breaking the wire. The capillary is then lowered such that one side of a bottom face (22) of the capillary is used to flatten the ball bond to form a flattened ball bump (38). In lowering the capillary, an entire width (W) of the bottom face lies over and is in contact with the entire top surface of the ball bump, and a chamfer (26) and feed hole (24) are located at or beyond a perimeter of the ball bump. The wire is then clamped and the capillary raised to break the wire from the ball bump.

REFERENCES:
patent: 4442967 (1984-04-01), van de Pas et al.
patent: 4661192 (1987-04-01), McShane
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5058798 (1991-10-01), Yamazaki et al.
patent: 5060843 (1991-10-01), Yasuzato et al.
patent: 5172851 (1992-12-01), Mastsushita et al.
B. Nachon; "Ball Bonding With Capillaries, The Basics of Wire Bonding," Kulicke & Soffa Industries, Inc. Applications Brochure (pp. 1-12), Copyright 1992.

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