Adhesive bonding and miscellaneous chemical manufacture – Methods
Patent
1974-10-29
1976-08-03
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
29625, 156 7, 156 18, 1563031, 156309, 156313, 156323, 174 685, C23F 102, B29D 300, C09J 500
Patent
active
039727556
ABSTRACT:
A method and apparatus is disclosed for bonding of dielectric circuit boa for microwave use, the bonding together of several circuit boards to form subassemblies and the bonding of subassemblies together. The finished circuit may include a bonded-in ground plate of copper wire cloth or the like and may include through-plate holes. The technique includes the build-up of thin films to provide strength, toughness and dimensional accuracy. Orthogonal positioning of directional stresses and cooling under pressure have a stabilizing effect. The bonding of copper or other conductive sheet or foil to the substrate is done without the use of a copper oxide or other coating and using only heat and pressure. An etched circuit in the copper sheet or foil, for example, is made flush with the finished surface of the board in the process. A normal bonding cycle comprises (1) loading the parts to be bonded in a confining mold, (2) placing a conforming mold plate within the mold and closing the parts in a press, (3) pressing for a predetermined time at a predetermined elevated temperature and (4) shock cooling the material before removing pressure from the mold.
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Powell William A.
Sciascia R. S.
The United States of America as represented by the Secretary of
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