Housing-free vertically insertable single-in-line circuit module

Details Housing-free vertically insertable single-in-line circuit module Housing-free vertically insertable single-in-line circuit module

1985-04-18

1987-08-25

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361405, 361412, H05K 720

Patent

active

046897194

ABSTRACT:
A housing-free, vertically insertable single-in-line circuit module has a carrier consisting of synthetic film or ceramic which carries a series of metal terminal pins and one or more electrical components including at least one integrated semiconductor circuit element, and associated conductor runs connecting the circuit element to the terminals, and the carrier has one lateral face thereof which is substantially covered by a metallic cooling sheet for permitting improved cooling of the circuit module by convection.

REFERENCES:
patent: 3020510 (1962-02-01), Kuch
patent: 3059152 (1962-10-01), Khouri
patent: 3280378 (1966-10-01), Brady
patent: 3437882 (1969-04-01), Cayzar
patent: 3616533 (1971-11-01), Heap
patent: 3694703 (1972-09-01), Wilens
patent: 3973817 (1976-08-01), Stalley
patent: 4107760 (1978-08-01), Zimmer
patent: 4109298 (1978-08-01), Hanni
patent: 4124864 (1978-11-01), Greenberg
patent: 4203147 (1980-05-01), Gabr
Cooling Conduction Structure for S-C Package, Mansuria, IBM Tech. Discl. Bull., vol. 23, No. 12, May 1981, pp. 5403.
Module with Internal Elements . . . Resistance, Arnold, IBM Tech. Discl. Bull., vol. 21, No. 4, Sep. 1978, pp. 1473.
Handbook of Electronic Packaging, Charles A. Harper, Editor, McGraw-Hill Book Company, 1969, pp. 9-75 to 9-83.

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