Subassembly for optoelectronic devices

Details Subassembly for optoelectronic devices Subassembly for optoelectronic devices

1988-03-03

1990-01-30

Davie, James W.

350 9617, 350 9618, H01L 2302, G02B 630

Patent

active

048977110

ABSTRACT:
A subassembly for use in packaging an optoelectronic device (e.g., LED or photodiode) includes a semiconductor (e.g., silicon) base and lid having a variety of etched features (e.g., grooves, cavities, alignment detents) and metalization patterns (e.g., contacts, reflectors) which enable the device to be reliably and inexpensively mounted on the base and coupled to the fiber.

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