Semiconductor wafer array

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Details

357 71, H01L 2348, H01L 2352

Patent

active

048977080

ABSTRACT:
A wafer array comprising a plurality of wafers of semiconductor material are stacked one on top of another. Through holes are provided in the wafers and electrically conductive liquid is inserted in the through holes for interconnecting all of the wafers. The conductive liquid is electrically insulated from all parts of the wafers except a part comprising an electrically conductive bonding pad which provides an electrical path between the conductive liquid and transistors located in the wafers. The wafers, which are disposed in a stack one on top of the other, are mounted in an enclosure and coupled to electrical pin members for connection to external devices.

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