Epoxy resin containing an epoxy resin-modified silicone oil flex

Details Epoxy resin containing an epoxy resin-modified silicone oil flex Epoxy resin containing an epoxy resin-modified silicone oil flex

1989-04-04

1992-10-20

Sellers, Robert E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

525476, 525487, 525525, C08K 336, C08L 6302, C08L 6304

Patent

active

051570610

ABSTRACT:
An epoxy resin composition for encapsulating a semiconductor device comprises a flexibilizer obtained by pre-reaction of an epoxy resin and at least one modified silicone oil having the formula: ##STR1## where R.sub.1, R.sub.3, and R.sub.4 are divalent organic groups; R.sub.21, R.sub.22, R.sub.23, R.sub.24, R.sub.25, R.sub.26, and R.sub.27 are respectively selected from the group consisting of an alkyl group having from 1 to 5 carbon atoms, a hydroxyalkyl group having from 1 to 5 carbon atoms, an alkoxy group having from 1 to 5 carbon atoms, a phenyl group, and a fluorine-substituted alkyl group having from 1 to 5 carbon atoms; a is an integer from 10 to 300; and b is an integer from 2 to 10, in which 0.ltoreq.b/(a+b).ltoreq.0.32, and wherein the equivalent ratio of phenolic hydroxyl groups in said modified silicone oil to epoxy groups of the epoxy resin of the flexibilizer is from 0.001 to 0.4:1; an epoxy resin other than the flexibilizer; and a curing agent.

REFERENCES:
patent: 3215648 (1965-11-01), Duffy et al.
patent: 4022753 (1977-05-01), Lohse et al.
patent: 4720515 (1988-01-01), Iji et al.
patent: 4923912 (1990-05-01), Sasaki et al.
English translation of Japanese Patent No. 62-254454, 22 pages.

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