Soldering composition

Details Soldering composition Soldering composition

1987-05-27

1988-03-15

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 26, B23K 3534

Patent

active

047311304

ABSTRACT:
A solder paste contains solder plated copper spheres in addition to particulate solder and flux. The paste can be used to solder leadless component carriers or the like to printed circuit boards., After melting the solder, the copper spheres are embedded in the resulting solder matrix, offsetting the carrier from the printed circuit board.

REFERENCES:
patent: 3597285 (1971-08-01), Aronberg
patent: 3703254 (1972-11-01), Maierson
patent: 4235649 (1980-11-01), Inamura

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