Non-selective implantation process for forming contact regions i

Fishing – trapping – and vermin destroying

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Other Related Categories

357 42, 437 34, 437175, H01L 21265, H01L 2128

Type

Patent

Status

active

Patent number

047094672

Description

ABSTRACT:
An integrated circuit fabrication technique for a maskless method of forming contact regions in integrated circuits is disclosed. By carefully controlling implant dosages, ions of one conductivity type can be introduced into substrate regions having the same conductivity type to form enhanced characteristic contact regions without affecting the operational characteristics of substrate regions having the opposite conductivity type. The resulting cross-sectional profile of the regions of the one conductivity type allows fabrication overlap tolerances to be reduced and improves the contact regions' imperviousness to the spiking phenomenon.

REFERENCES:
patent: 4404733 (1983-09-01), Sasaki
patent: 4541166 (1985-09-01), Yamazaki
patent: 4549914 (1985-10-01), Oh
patent: 4553315 (1985-11-01), McCarty
patent: 4575920 (1986-03-01), Tsunashima
Yamaguchi et al, IEEE Trans. Electron Devices, ED 32 (1985) 184.

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