Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1986-07-21
1987-08-25
Newsome, John H.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
51295, 291568B, 427204, 427203, B24D 1102
Patent
active
046892427
ABSTRACT:
Metal coated ceramic particles are bonded to a metallic substrate in a high temperature sintering process. A low viscosity binder solution containing fine metallic particulates is first applied to the substrate surface. Then, the coated ceramic particles are disposed upon the substrate surface, and the binder solution and the metal particulates therein are attracted by capillarity into regions of point contact between the ceramic particles and the substrate surface. During a subsequent high temperature sintering operation, the metal coating on the ceramic particles diffuses into the metal substrate, and the metallic particulates melt and solidify to bridge the gap between the substrate and ceramic particles.
REFERENCES:
patent: 2694647 (1954-11-01), Cole
patent: 3716347 (1973-02-01), Bergstrom et al.
patent: 4155721 (1979-05-01), Fletcher
patent: 4249913 (1981-02-01), Johnson et al.
patent: 4369098 (1983-01-01), Van Roeyen
patent: 4610698 (1986-09-01), Eaton et al.
patent: 4643740 (1987-02-01), Nicolson
Newsome John H.
Rashid James M.
United Technologies Corporation
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