Apparatus for removing adhesive tape wrapped around a printed ci

Details Apparatus for removing adhesive tape wrapped around a printed ci Apparatus for removing adhesive tape wrapped around a printed ci

1988-10-20

1990-01-30

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

156344, 156510, B32B 3118

Patent

active

048971480

ABSTRACT:
To remove adhesive tape wrapped around a printed circuit board, a taped board is caused to advance along a predetermined travel path; along that path, the adhesive tape is cut along the leading and trailing edges of the board, and then pried up and clamped at opposite corners of the leading edge, to eventually become removed simultaneously from both major faces of the board.

REFERENCES:
patent: 4466849 (1984-08-01), Dantsker
patent: 4724032 (1988-02-01), Kay

Affiliated with

Also associated with

Rating

Apparatus for removing adhesive tape wrapped around a printed ci does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for removing adhesive tape wrapped around a printed ci, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for removing adhesive tape wrapped around a printed ci will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1922061