Method of preparing a printed circuit board

Details Method of preparing a printed circuit board Method of preparing a printed circuit board

1995-06-05

1996-09-24

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29830, 156 89, 174266, 427 97, H01K 310

Patent

active

055578446

ABSTRACT:
Disclosed is a printed circuit board and a method of preparing the printed circuit board, The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes are for surface mount technology and terminate below the exterior surface of the printed circuit board. These plated through holes contain a fill composition.

REFERENCES:
patent: 3813773 (1974-06-01), Pouks
patent: 5261154 (1993-11-01), Ferrier et al.
patent: 5322593 (1994-06-01), Hasegawa et al.
patent: 5329695 (1994-07-01), Traskos et al.
patent: 5337466 (1994-08-01), Ishida
patent: 5426849 (1995-06-01), Kimbara et al.
patent: 5440805 (1995-08-01), Daigle et al.

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