Method of making a circuit board or layer thereof including semi

Details Method of making a circuit board or layer thereof including semi Method of making a circuit board or layer thereof including semi

1994-08-30

1996-09-24

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29830, 174259, H05K 328, H05K 338, H05K 346

Patent

active

055578438

ABSTRACT:
A printed circuit board and method of manufacture thereof is disclosed. The printed circuit board includes a first substrate provided from a conductive layer having disposed on a first surface thereof a cured adhesive layer, A semi-cured adhesive layer is then disposed over the cured adhesive layer and a second substrate is disposed against the semi-cured adhesive layer.

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