Fishing – trapping – and vermin destroying
Patent
1990-06-08
1992-10-20
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437902, 357 76, 357 80, 357 81, H01L 2180, H01L 2152, H01L 2158, H01L 2160
Patent
active
051569990
ABSTRACT:
A method for packaging a hybrid device which has a semiconductor laser diode and photodetectors. The laser diode is mounted on a silicon chip (a "silicon submount") containing a photodetector for monitoring the laser power. An array of silicon submounts are mounted on a heat-sink plate which consists of a heat-sink substrate covered with a metal layer. The metal layer is cut in multiple places down to the heat-sink substrate to form multiple conductive strips. The heat-sink plate with the silicon submounts is then covered with a heat-sink cover plate which has identations formed to provide cavities for the silicon submounts. In addition, cavities are provided to allow connections to the conducting metal strips. The combined assembly is then sliced into bars exposing an opening for the laser diode and openings for connections to the conductive strips. The bars are turned on their sides and laminated to a glass substrate to form a front window for the laser diode assembly. The bar is then cut into separate pieces, each having a single laser diode. A photodetector may be mounted on the front of the glass window before or after the bar is cut into pieces.
REFERENCES:
patent: 3840889 (1974-10-01), O'Brien et al.
patent: 3878556 (1975-04-01), Nyul
patent: 4360965 (1982-11-01), Fujiwara
patent: 4403243 (1983-09-01), Hakamada
patent: 4567598 (1986-01-01), Noguchi et al.
patent: 4604753 (1986-08-01), Sawai
patent: 4739546 (1988-04-01), Tachibana et al.
patent: 4757197 (1988-07-01), Lee
patent: 4803689 (1989-02-01), Shibanuma
patent: 4834491 (1989-05-01), Aoki et al.
patent: 4847848 (1989-07-01), Inoue et al.
patent: 4877756 (1989-10-01), Yamamoto et al.
patent: 4891333 (1990-01-01), Baba et al.
patent: 4894707 (1990-01-01), Yamawaka et al.
patent: 4910741 (1990-03-01), Pillsbury et al.
patent: 4953171 (1990-08-01), Nakajima et al.
Chaudhuri Olik
Graybill David E.
Lee Wai-Hon
LandOfFree
Packaging method for semiconductor laser/detector devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Packaging method for semiconductor laser/detector devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging method for semiconductor laser/detector devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-191904