IC card and method for manufacturing the same

Details IC card and method for manufacturing the same IC card and method for manufacturing the same

1987-09-11

1988-06-28

James, Andrew J.

Registers

Coded record sensors

Particular sensor structure

357 80, 235492, H01L 2328, H01L 2306, G06K 1906

Patent

active

047543191

ABSTRACT:
In an IC card according to the present invention, a base sheet formed of thermoplastic material is sandwiched between a substrate sheet and a dummy sheet both formed of nonplastic material lower in thermoplasticity than the base sheet. The substrate sheet is fitted with at least one IC chip and input/output terminals electrically connected to the IC chip. First and second cover sheets formed of thermoplastic material are put individually on the outer surfaces of the substrate sheet and the dummy sheet. The cover sheet on the substrate sheet is formed with apertures through which the input/output terminals are exposed to the outside.

REFERENCES:
patent: 4463971 (1984-08-01), Hoppe et al.
patent: 4532419 (1985-07-01), Takeda
patent: 4563575 (1986-01-01), Hoppe et al.

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