Method for fabricating semiconductor device including package

Details Method for fabricating semiconductor device including package Method for fabricating semiconductor device including package

1989-06-07

1991-09-17

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437214, 26427214, 174 525, H01L 232

Patent

active

050495267

ABSTRACT:
A method for fabricating and especially for encapsulating a semiconductor device in a plastic package is disclosed. In accordance with one embodiment of the invention the method includes steps of providing an encapsulation mold having a first chamber and a second chamber, with the second chamber spaced outwardly from and substantially surrounding the first chamber. The first chamber is shaped to receive a removable insert. An insert is selected for the particular body type and style which is desired and that insert is secured in the first chamber. The insert has a cavity which is shaped to define the desired encapsulated device package body. A lead frame is provided including a bonding area and a plurality of leads, each lead having a inner portion near the bonding area and an outer portion extending outwardly from the bonding area. A semiconductor device die is secured to the lead frame and the lead frame with the die attached is aligned within the encapsulation mold to place the semiconductor device die and the inner ends of the leads within the cavity defined by the inserts. The outer ends of the leads extend through the second chamber. Plastic material is then injected into the mold to form the device package body about the semiconductor device die. The package body is shaped by the cavity and the inserts and the carrier ring is shaped by the second chamber.

REFERENCES:
patent: 3627901 (1971-12-01), Happ
patent: 3942245 (1976-03-01), Jackson et al.
patent: 3982317 (1976-09-01), Eysermans
patent: 4026008 (1977-05-01), Drees et al.
patent: 4701999 (1987-10-01), Palmer
patent: 4859631 (1989-08-01), Barre

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