Printed circuit board having mutually etchable copper and nickel

Details Printed circuit board having mutually etchable copper and nickel Printed circuit board having mutually etchable copper and nickel

1979-09-19

1982-01-19

Gallagher, John J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

156902, 174 685, 427 98, 428639, 428901, B32B 1508

Patent

active

043117686

ABSTRACT:
A readily etchable printed circuit board is provided which comprises a resinous substrate having bonded to at least one surface thereof a composite metal structure. This metal structure includes a layer of copper foil having opposed first and second surfaces and a thin layer of nickel having opposed first and second surfaces with one of the surfaces of the copper foil being bonded to one of the surfaces of the nickel layer and the opposite opposed surface of the nickel layer being bonded to the resinous substrate with the nickel layer containing an effective amount of sulfur to render the copper foil and the nickel barrier layer mutually etchable, i.e., etchable by the same etchant. The preferred amount of sulfur ranges from about 0.05 to about 10.0 weight percent.

REFERENCES:
patent: 2233546 (1941-03-01), Meulendyke
patent: 2326999 (1943-08-01), Lind et al.
patent: 2984595 (1961-05-01), Schumpect et al.
patent: 3183067 (1965-05-01), Du Rose et al.
patent: 3585010 (1971-06-01), Luce et al.
patent: 3591350 (1971-07-01), Stareck et al.
patent: 4010005 (1977-03-01), Morisaki et al.
patent: 4061837 (1977-12-01), Hutkin

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